Inorganic filler, resin composition comprising the same and heat radiation substrate using the same
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United States of America Patent
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Feb 27, 2018
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N/A
app pub date -
May 4, 2017
filing date -
Jan 29, 2015
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Abstract
An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate and a coating layer formed on the boron nitride agglomerate and including a —Si—R—NH2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.
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