Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board
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United States of America Patent
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Feb 27, 2018
Issued Date -
N/A
app pub date -
Feb 21, 2014
filing date -
Jun 14, 2013
priority date (Note) -
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Abstract
There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The phenolic resin contains a binuclear compound (X) represented by the following Structural Formula (I), and a trinuclear compound (Y) represented by the following Structural Formula (II) as essential components:
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
- C07C:ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C09D:COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQ....
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....
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