Liquid ejecting head, and manufacturing method of liquid ejecting head
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United States of America Patent
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Feb 27, 2018
Issued Date -
N/A
app pub date -
Oct 17, 2016
filing date -
Oct 19, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A liquid ejecting head includes a first substrate in which a piezoelectric element is provided; and a second substrate on which the first substrate is connected to a first surface, in which the second substrate is provided with a penetration hole, which penetrates through the second substrate in a plate thickness direction, and penetration wiring, which is formed from a conductor that is formed in an inner portion of the penetration hole, the penetration wiring is formed from a first end portion, which is provided on a first surface side, a second end portion, which is provided on a second surface side, which is a surface that is on an opposite side to the first surface, and connection wiring, which connects the first end portion and the second end portion, and a cross-sectional area of the connection wiring in a planar direction of the first surface is smaller than cross-sectional areas of the first end portion and the second end portion in the planar direction.
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