Composite bonding tool with high thermal conductivity and low coefficient of thermal expansion
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United States of America Patent
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Feb 27, 2018
Issued Date -
N/A
app pub date -
Apr 21, 2015
filing date -
Apr 21, 2015
priority date (Note) -
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Abstract
A composite bonding tool may comprise a mold surface made from a composite material including a fibrous material and a matrix disposed about the fibrous material. The resin may be cured and have a thermal conductivity greater than about 10 watts per meter Kelvin. The fibrous material may be further metal coated or plated to increase thermal conductivity. Carbon nanomaterials may be added to the matrix or onto the surface of the fibrous material in order to further enhance thermal conductivity. The mold surface has a relatively high thermal conductivity and relatively low coefficient of thermal expansion, and a relatively low mass.
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International Classification(s)
- C09K:MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED ....
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- B29L:INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RE....
- D02G:CRIMPING OR CURLING FIBRES, FILAMENTS, YARNS, OR T....
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....
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