Systems and devices for achieving high throughput attachment and sub-micron alignment of components
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United States of America Patent
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Feb 27, 2018
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N/A
app pub date -
Jun 24, 2015
filing date -
Oct 28, 2014
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Abstract
Systems and devices for achieving high throughput attachment of sub-micron alignment of components are provided. One such device can include a fixture for holding a chuck, the fixture including a plurality of alignment features for adjusting a position of the chuck, the chuck includes a top layer including a vacuum aperture for holding a first component and a bottom layer made from a translucent material, wherein the bottom layer is directly attached to the top layer.
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