Manufacturing method of a rigid flex board module
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United States of America Patent
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Feb 20, 2018
Issued Date -
N/A
app pub date -
Dec 31, 2015
filing date -
Aug 26, 2013
priority date (Note) -
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Abstract
A rigid flex board module includes a rigid flex circuit board and a high-density interconnected circuit board. The rigid flex circuit board includes a flexible circuit board, a first rigid circuit board and a first adhesive layer. The flexible circuit board includes a bending portion and a jointing portion connected to the bending part. The rigid flex circuit board is disposed on the jointing portion to expose the bending portion. The first rigid circuit board electrically connects with the flexible circuit board. The first adhesive layer connects the first rigid circuit board and the jointing portion. The high-density interconnected circuit board is disposed in the first rigid circuit board and is electrically connected to the first rigid circuit board.
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