Buttoned soldering pad for use with fine-pitch hot bar soldering
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United States of America Patent
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Feb 20, 2018
Issued Date -
N/A
app pub date -
Nov 12, 2014
filing date -
Nov 12, 2013
priority date (Note) -
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Abstract
A method of soldering can include: providing a first electronic component having a first buttoned soldering pad including a first soldering pad and one or more first button heads protruding from a first surface of the soldering pad; providing a second electronic component having a soldering pad; and soldering the first buttoned soldering pad to the soldering pad. The method includes introducing solder to spaces around the one or more first buttons of the first buttoned soldering pad. The method includes introducing a first solder to spaces around the one or more first buttons of the first buttoned soldering pad; introducing a second solder to spaces around one or more second buttons of a second buttoned soldering pad of the first electronic component; and forming spaces between the first and second solder that electronically insulate the first solder from the second solder.
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