Lead frame and light emitting diode package having the same

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United States of America Patent

PATENT NO 9899587
SERIAL NO

15434173

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Abstract

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A lead frame for an LED package includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes separated first and second connecting surfaces. Top surfaces of the bonding electrode, the first connecting electrode, and the second connecting electrode are exposed, and support and electrically connect with light emitting chips. LED packages can be mounted on the lead frame and electrically connect with each other. The conductive layout of the lead frame further permits installation of a zener diode which can be connected to the LED packages in series or in parallel.

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Patent Owner(s)

Patent OwnerAddress
ADVANCED OPTOELECTRONIC TECHNOLOGY INCNO 13 GONGYE 5TH RD HSINCHU INDUSTRIAL PARK HUKOU TOWNSHIP HSINCHU COUNTY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Chao-Hsiung Hsinchu, TW 75 231
Chen, Lung-Hsin Hsinchu, TW 101 330
Chen, Pin-Chuan Hsinchu, TW 96 225
Hsieh, Yu-Lun Hsinchu, TW 5 39
Huang, Che-Hsang Hsinchu, TW 9 22
Huang, Yu-Liang Hsinchu, TW 20 108
Jang, Yau-Tzu Hsinchu, TW 10 18
Lo, Hsing-Fen Hsinchu, TW 22 81
Tseng, Wen-Liang Hsinchu, TW 94 434

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