Slim LED package
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United States of America Patent
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Feb 20, 2018
Issued Date -
N/A
app pub date -
Nov 16, 2016
filing date -
Dec 3, 2007
priority date (Note) -
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Abstract
Disclosed herein is a slim LED package. The slim LED package includes first and second lead frames separated from each other, a chip mounting recess formed on one upper surface region of the first lead frame by reducing a thickness of the one upper surface region below other upper surface regions of the first lead frame, an LED chip mounted on a bottom surface of the chip mounting recess and connected with the second lead frame via a bonding wire, and a transparent encapsulation material protecting the LED chip while supporting the first and second lead frames.
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