Wiring substrate and method of manufacturing the same
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United States of America Patent
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Feb 20, 2018
Issued Date -
N/A
app pub date -
Oct 14, 2016
filing date -
Oct 19, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A wiring substrate includes an insulating layer, at least one via hole formed in the insulating layer, a first wiring layer formed on one surface of the insulating layer and having a droop portion at an end-side of the via hole, a second wiring layer formed on the other surface of the insulating layer, and a metal-plated layer formed in the via hole and configured to connect the second wiring layer and the droop portion of the first wiring layer. One surface of the insulating layer around the via hole is formed as a convex curved surface and the droop portion of the first wiring layer is arranged on the convex curved surface.
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