Electronic package and fabrication method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 20, 2018
Issued Date -
N/A
app pub date -
Sep 23, 2015
filing date -
Oct 15, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for fabricating an electronic package is provided, which includes the steps of: providing an insulating layer having at least an electronic element embedded therein; forming at least a first via hole on one side of the insulating layer; forming a first conductor in the first via hole of the insulating layer; forming on the insulating layer a first circuit structure electrically connected to the electronic element and the first conductor; and forming a second via hole on the other side of the insulating layer, wherein the second via hole communicates with the first via hole. As such, the second via hole and the first via hole constitute a through hole. Since the through hole is fabricated through two steps, the aspect ratio (depth/width) of the through hole can be adjusted according to the practical need so as to improve the process yield.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2015 Application Filing Year
- H01L Class
- 25498 Applications Filed
- 22451 Patents Issued To-Date
- 88.06 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- H01L Class
- 23.71 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Aug 20, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Aug 20, 2029 |
