Carrier, semiconductor package and fabrication method thereof
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United States of America Patent
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Feb 20, 2018
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N/A
app pub date -
Feb 7, 2014
filing date -
Jan 20, 2012
priority date (Note) -
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Abstract
A fabrication method of a semiconductor package includes the steps of: providing a carrier having a concave portion and a releasing layer formed on a surface thereof; disposing a chip on the releasing layer in the concave portion; forming an encapsulant on the chip and the releasing layer; removing the releasing layer and the carrier; and forming a circuit structure on the encapsulant and the chip. The design of the concave portion facilitates alignment of the chip to prevent it from displacement, thereby improving the product reliability. A semiconductor package fabricated by the fabrication method is also provided.
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