Apparatus for advanced packaging applications
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 20, 2018
Issued Date -
N/A
app pub date -
Aug 8, 2016
filing date -
May 29, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The embodiments disclosed herein pertain to novel methods and apparatus for removing material from a substrate. In certain embodiments, the method and apparatus are used to remove negative photoresist, though the disclosed techniques may be implemented to remove a variety of materials. In practicing the disclosed embodiments, a stripping solution may be introduced from an inlet to an internal manifold, sometimes referred to as a cross flow manifold. The solution flows laterally through a relatively narrow cavity between the substrate and the base plate. Fluid exits the narrow cavity at an outlet, which is positioned on the other side of the substrate, opposite the inlet and internal manifold. The substrate spins while in contact with the stripping solution to achieve a more uniform flow over the face of the substrate. In some embodiments, the base plate includes protuberances which operate to increase the flow rate (and thereby increase the local Re) near the face of the substrate.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2016 Application Filing Year
- C25D Class
- 667 Applications Filed
- 443 Patents Issued To-Date
- 66.42 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 9 Citation Count
- C25D Class
- 45.04 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Aug 20, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Aug 20, 2029 |
