Molded leadframe substrate semiconductor package
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United States of America Patent
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Feb 20, 2018
Grant Date -
Mar 31, 2011
app pub date -
Dec 9, 2010
filing date -
Dec 14, 2006
priority date (Note) -
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Abstract
A process for forming land grid array semiconductor packages includes a leadframe that is supported by a substrate comprising mold compound. In some embodiments, at least one die is electrically coupled to the leadframe by bondwires. The package comprises a second mold compound to act as an encapsulant. An apparatus for forming a land grid array semiconductor package includes means for molding a leadframe, assembling thereon at least one semiconductor device, applying a second mold, and singulating to form individual devices. A land grid array package comprises a leadframe, a substrate for supporting the leadframe, at least one semiconductor device and a mold compound.
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