Fixing structure for heat dissipation element
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United States of America Patent
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Feb 20, 2018
Issued Date -
N/A
app pub date -
Mar 17, 2015
filing date -
Mar 17, 2015
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A fixing structure for heat dissipation element includes a base plate, a heat transfer element, and at least one fixing member. The base plate has a top surface, on which a receiving recess is defined for receiving the heat transfer element therein. At least one clearance is defined between the receiving recess and the heat transfer element. The fixing member has a fixing portion and an extended portion. The fixing portion is connected to the top surface of the base plate, whereas the extended portion is bent and inserted into the clearance to locate between the receiving recess and the heat transfer element, such that the heat transfer element is firmly held in the receiving recess of the base plate.

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- 15 United States
- 10 France
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- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
ASIA VITAL COMPONENTS CO LTD | 7F -3 NO 24 WUCYUAN 2ND RD SINJHUANG CITY TAIPEI COUNTY 242 R O C |
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- [Classification Symbol]
- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Lee, Sheng-Pei | New Taipei, TW | 5 | 31 |
Wu, Chun-Ming | New Taipei, TW | 92 | 478 |
Wu, Jing-Ning | New Taipei, TW | 3 | 10 |
Yu, Ming-Han | New Taipei, TW | 11 | 21 |
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