Integrated semiconductor device and manufacturing method
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United States of America Patent
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Feb 20, 2018
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N/A
app pub date -
Jul 13, 2016
filing date -
Jul 17, 2015
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Abstract
The present disclosure relates to an integrated semiconductor device, comprising a semiconductor substrate; a cavity formed into the semiconductor substrate; a sensor portion of the semiconductor substrate deflectably suspended in the cavity at one side of the cavity via a suspension portion of the semiconductor substrate interconnecting the semiconductor substrate and the sensor portion thereof, wherein an extension of the suspension portion along the side of the cavity is smaller than an extension of said side of the cavity.
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