Ultraviolet ray emitting package having resin adhesive layer and ultraviolet ray irradiating apparatus

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United States of America Patent

PATENT NO 9895459
SERIAL NO

15291375

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An ultraviolet ray emitting package includes: a substrate having an upper portion defining a recess; an ultraviolet ray emitting element provided within the recess of the substrate; an ultraviolet ray transmitting window member provided on the upper portion of the substrate to cover the recess of the substrate; a resin adhesive layer provided between the upper portion of the substrate and the ultraviolet ray transmitting window member; and an optical shielding layer provided between the resin adhesive layer and the ultraviolet ray transmitting window member.

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Patent Owner(s)

Patent OwnerAddress
STANLEY ELECTRIC CO LTD2-9-13 NAKAMEGURO MEGURO-KU TOKYO 153-8636

International Classification(s)

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  • 2016 Application Filing Year
  • F21V Class
  • 4134 Applications Filed
  • 3005 Patents Issued To-Date
  • 72.69 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kato, Hiroyuki Kanagawa, JP 407 3482
Matsuda, Junji Kanagawa, JP 12 101
Ohkubo, Tsutomu Tokyo, JP 23 139
Taniguchi, Kazuyoshi Kanagawa, JP 6 52

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Patent Citation Ranking

  • 1 Citation Count
  • F21V Class
  • 23.81 % this patent is cited more than
  • 7 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges281712121341665121101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7081 - 9091 - 100100 +050100150200250300350400450500550600650700750

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