Thermal sink with an embedded heat pipe
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United States of America Patent
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Feb 13, 2018
Issued Date -
N/A
app pub date -
Nov 18, 2016
filing date -
Nov 18, 2016
priority date (Note) -
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Abstract
Heat sinks and thermal cooling systems are disclosed. The heat sinks and thermal cooling systems include fins, which extend away from a surface of a base of the heat sink, and which are located in a finned region on the surface. The heat sinks and thermal cooling systems also include one or more heat pipes that are positioned and shaped in a way so that a first portion of each heat pipe is in contact with the surface of the base, while at least a second portion of each heat pipe is raised above the surface of the base in into contact with fins in the finned region. Raising the heat pipes away from the surface of the base prevents components in contact with, or adjacent to, the base from being heated by the heat pipes.
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