Passive system of powering and cooling with liquid metal and method thereof
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United States of America Patent
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Feb 13, 2018
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app pub date -
May 29, 2014
filing date -
May 29, 2014
priority date (Note) -
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Abstract
Example embodiments disclose a passive system of power and cooling with a liquid metal for a digital system. The passive system may include a digital device operatively coupled to a printed circuit board, a hollow conductive channel body attached to the printed circuit board to circulate the liquid metal to flow within the conductive channel so as to convey electrical power to the digital device during a power loss and transfer heat generated by the digital device, and a tube to deliver the liquid metal in and out of the hollow conductive channel body. A method of operating a liquid metal may involve the use of the passive system.
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