Three-dimensional laminated wiring substrate
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United States of America Patent
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Feb 13, 2018
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N/A
app pub date -
Aug 29, 2014
filing date -
Mar 6, 2012
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Abstract
A three-dimensional laminated wiring substrate is provided and includes a plurality of wiring substrates disposed on top of each other. Each of the plurality of wiring substrates includes an insulating film and a conductor pattern. The insulating film is disposed along a surface to provide a three-dimensional surface. The conductor pattern is disposed on and extending along the three-dimensional surface.
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