Microphone package with molded spacer
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United States of America Patent
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Feb 13, 2018
Issued Date -
N/A
app pub date -
Apr 19, 2017
filing date -
Oct 29, 2014
priority date (Note) -
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Abstract
A microelectromechanical system (MEMS) microphone package including a MEMS microphone die configured to sense acoustic pressure and to generate a signal based on the acoustic pressure. An application specific integrated circuit (ASIC) electrically connects to the MEMS microphone die. The MEMS microphone package includes a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms side walls of the MEMS microphone package and is adapted to route electrical connections from the MEMS microphone die and the ASIC to the substrate.
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