Photo sensor module
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United States of America Patent
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Feb 13, 2018
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N/A
app pub date -
Sep 13, 2016
filing date -
Aug 19, 2014
priority date (Note) -
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Abstract
The present disclosure relates to a photo sensor module. The thickness and size of an IC chip may be reduced by manufacturing a photo sensor based on a semiconductor substrate and improving the structure to place a UV sensor on the upper section of an active device or a passive device. The photo sensor module includes a semiconductor substrate, a field oxide layer, formed on the semiconductor substrate, and a photo sensor comprising a photo diode formed on the field oxide layer.
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