Reliable device assembly
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United States of America Patent
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Feb 13, 2018
Issued Date -
N/A
app pub date -
Jul 18, 2016
filing date -
Jun 21, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Microelectronic assemblies and methods for making the same are disclosed herein. In one embodiment, a method of forming a microelectronic assembly comprises assembling first and second components to have first major surfaces of the first and second components facing one another and spaced apart from one another by a predetermined spacing, the first component having first and second oppositely-facing major surfaces, a first thickness extending in a first direction between the first and second major surfaces, and a plurality of first metal connection elements at the first major surface, the second component having a plurality of second metal connection elements at the first major surface of the second component; and plating a plurality of metal connector regions each connecting and extending continuously between a respective first connection element and a corresponding second connection element opposite the respective first connection element in the first direction.
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Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Aug 13, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Aug 13, 2029 |
