Terminal structure and wiring substrate
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United States of America Patent
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-
Feb 13, 2018
Issued Date -
N/A
app pub date -
Dec 8, 2016
filing date -
Dec 18, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A terminal structure of a wiring substrate includes a wiring layer, a protective insulation layer including an opening that partially exposes an upper surface of the wiring layer, and a connection terminal formed on the wiring layer. The connection terminal includes a base portion formed in the opening and a connection portion formed on the base portion. The connection portion projects from an upper surface of the protective insulation layer. A gap is formed between a side surface of the base portion and a wall surface of the opening.
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