Semiconductor module having stacked insulated substrate structures
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United States of America Patent
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Feb 13, 2018
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app pub date -
Apr 28, 2015
filing date -
Apr 28, 2015
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Abstract
A semiconductor module (100) has a first insulating substrate (11); a first conductor layer (12) provided on a mounting surface of the first insulating substrate (11); a first electronic element (13) provided on the first conductor layer (12); a sealing resin (80), which covers an overall mounting region within the mounting surface of the first insulating substrate (11), the first conductor layer (12), and the first electronic element (13); and a frame body (70), which is made of metal and covers the overall sealing resin (80).
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