Encapsulated micro-electromechanical system switch and method of manufacturing the same
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United States of America Patent
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Feb 13, 2018
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app pub date -
Jan 11, 2012
filing date -
Jan 11, 2011
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Abstract
Encapsulated MEMS switches are disclosed along with methods of manufacturing the same. A non-polymer based sacrificial layer is used to form the actuation member of the MEMS switch while a polymer based sacrificial layer is used to form the enclosure that encapsulates the MEMS switch. The first non-polymer based sacrificial layer allows for highly reliable MEMS switches to be manufactured while also protecting the MEMS switch from carbon contamination. The polymer based sacrificial layer allows for the manufacture of more spatially efficient encapsulated MEMS switches.
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