Wireless bus for intra-chip and inter-chip communication, including wireless-enabled component (WEC) embodiments
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United States of America Patent
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Feb 13, 2018
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Apr 7, 2015
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Jan 27, 2010
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Abstract
Embodiments of the present invention are directed to a wireless-enabled component (WEC) for enabling a wireless bus for intra-chip and inter-chip communication. A WEC encompasses a functional block of an IC (such as, for example, a processing core of a processing unit), an entire IC (such as, for example, a processing unit), or a device that includes a plurality of ICs (such as, for example, a handheld device). According to embodiments, a WEC may be associated with one or more sub-blocks of an IC, a single IC, or a plurality of ICs.
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