Microelectronic packages having split gyroscope structures and methods for the fabrication thereof
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United States of America Patent
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Feb 13, 2018
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app pub date -
Aug 15, 2014
filing date -
Aug 15, 2014
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Abstract
Methods for fabricating microelectronic packages and microelectronic packages having split gyroscope structures are provided. In one embodiment, the microelectronic package includes a first Microelectromechanical Systems (MEMS) die having a first MEMS gyroscope structure thereon. The microelectronic package further includes a second MEMS die, which has a second MEMS gyroscope structure thereon and which is positioned in a stacked relationship with the first MEMS die. The first and second MEMS gyroscope structures overlap as taken along a first axis orthogonal to a principal axis of the first MEMS die.
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