Thermal needle probe
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United States of America Patent
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Feb 13, 2018
Issued Date -
N/A
app pub date -
Sep 2, 2015
filing date -
Sep 2, 2015
priority date (Note) -
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Abstract
According to embodiments of the disclosure, a thermal needle probe is provided. The thermal needle probe may include a heater, a cooler, a temperature measuring element, a heat conduction element and a processor. The heater is configured to heat an object. The cooler is configured to cool the object. The temperature measuring element is configured to measure a temperature raising curve of the object and a temperature dropping curve of the object. The heat conduction element is configured to conduct heat between the heater and the object. The processor is configured to determine a thermal property of the object according to at least one of the temperature raising curve and the temperature dropping curve.
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