Epoxy compound, epoxy resin, curable compound, cured product thereof, semiconductor sealing material, and printed circuit board
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United States of America Patent
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Feb 13, 2018
Issued Date -
N/A
app pub date -
Feb 27, 2014
filing date -
Jun 26, 2013
priority date (Note) -
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Abstract
There is provided an epoxy compound exhibiting excellent heat resistance and flame retardance of a cured product thereof; an epoxy resin containing the epoxy compound; a curable composition and a cured product thereof; and a semiconductor sealing material. The epoxy compound has a diarylene[b,d]furan structure, in which at least one of two arylene groups has a naphthylene skeleton and two arylene groups each include a glycidyloxy group on an aromatic nucleus thereof.
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
- C07D:HETEROCYCLIC COMPOUNDS
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....
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