Planar cavity MEMS and related structures, methods of manufacture and design structures
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United States of America Patent
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Feb 13, 2018
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N/A
app pub date -
Jul 18, 2016
filing date -
Jun 25, 2010
priority date (Note) -
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Abstract
A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B81C:PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE M....
- G06F:ELECTRIC DIGITAL DATA PROCESSING
- B81B:MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-ME....
- H01H:ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PR....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
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