Hermetically sealed feedthrough with co-fired filled via and conductive insert for an active implantable medical device
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United States of America Patent
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Feb 13, 2018
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N/A
app pub date -
Jul 11, 2015
filing date -
Jan 16, 2012
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Abstract
A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.
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