Single-layer metalization and via-less metamaterial structures

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United States of America Patent

PATENT NO 9887465
SERIAL NO

13932998

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Abstract

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Techniques and apparatus based on metamaterial structures provided for antenna and transmission line devices, including single-layer metallization and via-less metamaterial structures.

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TYCO ELECTRONICS SERVICES GMBH8200 SCHAFFHAUSEN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Achour, Maha Encinitas, US 125 4613
Gummalla, Ajay Sunnyvale, US 49 3706
Lee, Cheng Jung Santa Clara, US 14 400
Pathak, Vaneet Palo Alto, US 54 1525
Poilasne, Gregory El Cajon, US 77 4238

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