Infrared sensor, thermal imaging camera and method for producing a microstructure from thermoelectric sensor rods
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United States of America Patent
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Feb 6, 2018
Grant Date -
Feb 19, 2015
app pub date -
Feb 11, 2013
filing date -
Mar 12, 2012
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Abstract
An infrared sensor with a microstructure has a multiplicity of sensor rods protruding from a sensor base and arranged axially parallel to one another. Each of the sensor rods is designed as a thermocouple, in that a first rod end, arranged on the sensor base, is electrically connected to an opposite free second rod end by both a first and a second electrically conductive rod element. The two rod elements have a different Seebeck coefficient, and the first rod element is formed as a hollow profile and the second rod element is arranged in the first rod element such that each thermocouple is formed as a single rod with a small standing area on the sensor base.
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