Packaging of LED chips and driver circuit on the same substrate
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United States of America Patent
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Feb 6, 2018
Issued Date -
N/A
app pub date -
Oct 31, 2016
filing date -
Dec 20, 2011
priority date (Note) -
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Abstract
The purpose of the present invention is to reduce the size and thickness of an LED module. The LED module includes a circuit substrate, at least two supply terminals, a plurality of LED dies, a plurality of FET die, a constant current circuit, a dam member, a fluorescent resin, a resistor network, and a bypass circuit, wherein the constant current circuit includes one of the plurality of FET die and the bypass circuit includes other of the plurality of FET die, a portion of the dam enclosing the LED block region forms a portion of the dam enclosing the circuit block region, and the dam member enclosing the LED block region has a annular shape and the dam member enclosing the circuit block region has a rectangular shape except for said portion of the dam member.
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