Semiconductor device manufacturing method, semiconductor device, and wire bonding apparatus
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United States of America Patent
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Feb 6, 2018
Grant Date -
Dec 8, 2016
app pub date -
Aug 18, 2016
filing date -
Feb 21, 2014
priority date (Note) -
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Abstract
A semiconductor device manufacturing method includes: raising and moving a bonding tool, while paying out a wire, in a direction from a second toward a first bonding point to form in the wire a cut portion bent in a vicinity of the second bonding point; lowering and moving a tip of the bonding tool to the cut portion; lowering the bonding tool vertically to thin the cut portion; raising the bonding tool while paying out the wire; and moving the bonding tool in a direction away from the first and second bonding points and along a wire direction connecting the first and second bonding points and then cutting the wire at the cut portion to form a wire tail. This allows the length of the wire tail to be adjusted easily and efficiently to be constant.
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