Semiconductor package and method of manufacturing the same
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United States of America Patent
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Feb 6, 2018
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N/A
app pub date -
Apr 1, 2016
filing date -
Nov 17, 2015
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Abstract
The present invention relates to a semiconductor package and a method of manufacturing the same. Specifically, the present invention relates to a semiconductor package including a substrate; a semiconductor chip mounted on the substrate; a connection element including an insulator mounted on the substrate and a first connection part of a conductive material formed at an end of the insulator; a molding part surrounding the semiconductor chip, and sealing the connection element for an upper surface of the first connection part to be exposed; and a shield layer surrounding the molding part, and forming an opening part on a part corresponding to the first connection part.
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