Circuit redistribution structure unit and method for manufacturing circuit redistribution structure
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 6, 2018
Issued Date -
N/A
app pub date -
Sep 6, 2016
filing date -
Jun 30, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for manufacturing a circuit redistribution structure includes the following steps. A first dielectric is formed on a carrier. Conductive blind vias are formed in the first dielectric. A first circuit redistribution layer is formed on the first dielectric. A second dielectric is formed on the first dielectric. First and second holes are formed on the second dielectric. A trench is formed in the second dielectric to divide the second dielectric into first and second portions. A first portion of the first circuit redistribution layer and the first hole are disposed in the first portion of the second dielectric, and a second portion of the first circuit redistribution layer and the second hole are disposed in the second portion of the second dielectric. Conductive blind vias are formed in the first and second holes, and a second circuit redistribution layer is formed on the second dielectric.
First Claim
Other Claims data not available
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Aug 6, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Aug 6, 2029 |
