Fan-out semiconductor package structure and fabricating method
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United States of America Patent
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Feb 6, 2018
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app pub date -
Feb 21, 2017
filing date -
Feb 21, 2017
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Abstract
A fan-out semiconductor package includes a layer of adhesive covering a temporary carrier, a first redistribution layer disposed on the layer of adhesive, the first redistribution layer including a first metal layer having recessed areas. Metal pillars are plated to a first group of the recessed areas in the first metal layer. A semiconductor chip next is bonded to a second group of the recessed areas and a molding compound covers the semiconductor chip. The molding compound is then ground to expose tops of the metal pillars. A second redistribution layer including a second passivation layer adhering to the molding compound and a second metal layer covering openings exposing the tops of the metal pillars are then added.
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