Wafer processing method
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United States of America Patent
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Feb 6, 2018
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app pub date -
Apr 10, 2017
filing date -
Apr 13, 2016
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Abstract
There is provided a wafer processing method for dividing a wafer having a plurality of devices formed in regions partitioned by a plurality of crossing division lines on a front surface of a substrate having a birefringent crystal structure, into individual device chips. The wafer processing method includes a detection step of detecting the division line formed on the front surface of the wafer by an imaging unit from the back side of the wafer. In the detection step, a polarizer disposed on an optical axis connecting an imaging element and an image forming lens provided in the imaging unit intercepts extraordinary light appearing due to birefringence in the substrate and guides ordinary light to the imaging element.
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