Apparatus for treating surfaces of wafer-shaped articles
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United States of America Patent
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Feb 6, 2018
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app pub date -
Nov 3, 2015
filing date -
Nov 3, 2015
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Abstract
A rotary chuck for processing wafer-shaped articles comprises a chuck body having a series of gripping pins that are movable by sliding horizontally and in unison relative to the chuck body from a first position in which the gripping pins are relatively more retracted into the chuck body to a second position in which the gripping pins are relatively more extended from the chuck body and in which the gripping pins are positioned so as to support a wafer-shaped article of a predetermined diameter.
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