Wafer processing method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 6, 2018
Issued Date -
N/A
app pub date -
May 5, 2015
filing date -
May 13, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of processing a wafer includes: a grinding step of grinding a back surface of the wafer to form, on the back side of the wafer, a recess corresponding to a device region and an annular projecting portion corresponding to a peripheral marginal region; and a splitting groove forming step of forming, after the grinding step is conducted, a splitting groove for splitting the device region and the peripheral marginal region from each other at the boundary between the recess and the annular projecting portion, the splitting groove extending from the front surface of the wafer to reach the back surface of the wafer. The splitting groove is formed by dry etching.
First Claim
Other Claims data not available
Family
International Classification(s)
- B24B:MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR PO....
- C03C:CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREO....
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....
- C23F:NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM S....
- B44C:PRODUCING DECORATIVE EFFECTS
- 2015 Application Filing Year
- B24B Class
- 630 Applications Filed
- 508 Patents Issued To-Date
- 80.64 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 2 Citation Count
- B24B Class
- 37.85 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Aug 6, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Aug 6, 2029 |
