Micromechanical sensor system and corresponding manufacturing method
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United States of America Patent
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Feb 6, 2018
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N/A
app pub date -
Aug 28, 2014
filing date -
Aug 30, 2013
priority date (Note) -
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Abstract
A micromechanical sensor system includes a micromechanical sensor chip surrounded at least laterally by a molded housing which has a front side and a rear side. The micromechanical sensor chip includes a chip area on the rear side, which is omitted from the molded housing, and a rewiring device formed on the rear side, which, starting from the chip area, extends to the surrounding molded housing on the rear side, and from there, past at least one via from the rear side to the front side of the molded housing.
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