Wiring substrate for bonding using solder having a low melting point and method for manufacturing same
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United States of America Patent
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Jan 30, 2018
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N/A
app pub date -
Jul 24, 2015
filing date -
Jan 28, 2013
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Abstract
There is provided a wiring substrate including an electrode including Cu or a Cu alloy, a plating film having a film including at least Pd, formed on the electrode, and a solder which is bonded onto the plating film by heating, has a melting point of lower than 140° C., and includes Pd dissolved therein, a Pd concentrated layer being absent between the solder and the electrode.
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