Package structure and manufacturing method thereof
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United States of America Patent
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Jan 30, 2018
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N/A
app pub date -
Nov 16, 2016
filing date -
Oct 7, 2016
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Abstract
A package structure includes a circuit substrate, first and second build-up circuit structures, and a plurality of piezoelectric heat dissipation units. The circuit substrate includes a core layer, a plurality of electronic devices, and a conducting unit. The electronic devices are embedded in the core layer, and active surfaces of the two adjacent electronic devices respectively face a first surface and a second surface of the core layer. The conducting unit is disposed on the core layer and electrically connected to the electronic devices. The first and second build-up circuit structures are respectively disposed on the first and the second surfaces and respectively have at least one first and at least one second openings. The piezoelectric heat dissipation units respectively correspond to the active surfaces of the electronic devices and are electrically connected to the conducting unit exposed by the first and the second openings.
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