Three dimensional image pick-up device and manufacturing method thereof

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United States of America Patent

PATENT NO 9883166
SERIAL NO

14611375

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Abstract

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A 3-D image pick-up device is disclosed, the device including: a PCB mounted with two camera modules including an image sensor; and a reinforcing member mounted with two exposure windows, wherein the PCB and the reinforcing member are mutually adhered to allow the camera modules of the PCB to be exposed through the exposure window of the reinforcing member.

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Patent Owner(s)

Patent OwnerAddress
LG INNOTEK CO LTDSEOUL

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jeong, Seongcheol Seoul, KR 13 131
Oh, Sangyun Seoul, KR 13 78

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