Interconnection assemblies and methods for forming the interconnection assemblies in a battery module
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United States of America Patent
Stats
-
Jan 30, 2018
Issued Date -
N/A
app pub date -
Sep 30, 2014
filing date -
Aug 31, 2011
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Interconnection assemblies and methods are provided. An interconnection assembly includes a first cell tab constructed of a first metal, and a second cell tab disposed against the first cell tab. The second cell tab is constructed of a second metal having a hardness greater than the first metal. The assembly further includes an interconnect member disposed against the second cell tab. The assembly further includes a weld assisting layer disposed against the first cell tab such that the first and second cell tabs are disposed between the weld assisting layer and the interconnect member.
First Claim
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International Classification(s)
- 2014 Application Filing Year
- H01M Class
- 4927 Applications Filed
- 4171 Patents Issued To-Date
- 84.66 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- H01M Class
- 31.62 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jul 30, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 30, 2029 |
