OLED backplane and fabrication method thereof
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United States of America Patent
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Jan 30, 2018
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N/A
app pub date -
Jul 25, 2014
filing date -
Oct 18, 2013
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Abstract
Disclosed are an OLED backplane and fabrication method. The fabrication method comprises: forming a pattern including a TFT on a substrate; forming a passivation layer on the substrate including the TFT pattern; forming a color filter on the substrate including the passivation layer; forming a resin layer on the substrate including the color filter; heavily doping the resin layer of a first region in each sub-pixel on the substrate including the resin layer, the resin layer in the first region being conductive, the first region including a passivation layer via-hole region, a pixel electrode region and a connecting region between the passivation layer via-hole region and the pixel electrode region, the passivation-layer via-hole region being a position where a drain electrode of the TFT is located; and forming an organic light-emitting layer and a cathode sequentially on the substrate after the resin layer of the first region is heavily doped.
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