Encapsulation structure, encapsulating method and display device

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United States of America Patent

PATENT NO 9882162
SERIAL NO

15104415

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Abstract

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Embodiments of the present disclosure disclose an encapsulation structure, an encapsulating method and a display device. The encapsulation structure includes a first substrate and a second substrate arranged opposite to each other, and a sealing structure provided between the first substrate and the second substrate. Wherein the sealing structure is provided with one or more voids, and a filler is provided within the one or more voids and includes a gas-absorbing material.

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Patent Owner(s)

  • BOE TECHNOLOGY GROUP CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hong, Rui Beijing, CN 40 158

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