LED package with covered bonding wire
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United States of America Patent
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Jan 30, 2018
Issued Date -
N/A
app pub date -
Jan 12, 2017
filing date -
Jan 12, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is an LED package which is unlikely to cause the attenuation of emitted light from an LED element by bonding wires for electrical connection of the LED element. The LED package includes a board including a pair of connection electrodes formed thereon, an LED element mounted on the board, a bonding wire electrically connecting the LED element to the pair of connection electrodes, and a covering layer containing a phosphor and covering the bonding wire, wherein the phosphor is excited by emitted light from the LED element to emit light having an absorbance in the bonding wire lower than that of the emitted light and a wavelength longer than that of the emitted light.
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